ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,939, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate bonding device, calculation device, substrate b... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,940, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Method for measuring temperature" was invented by Yukio O... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,941, issued on April 7, was assigned to EBARA Corp. (Tokyo). "Apparatus for processing substrate, device of controlling apparatus for proce... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,942, issued on April 7, was assigned to Shanghai Huali Microelectronics Corp. (Shanghai). "Method for analyzing layout pattern density" was... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,943, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Wafer boat system, holder ring and use thereof" was inv... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,944, issued on April 7, was assigned to LG Electronics Inc. (Seoul, South Korea). "Chip tray for self-assembly, and method for supplying se... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,945, issued on April 7, was assigned to Tokyo Electron Ltd. (Tokyo). "Path setting system, path setting method, and software" was invented ... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,946, issued on April 7, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Fixtures and methods for positioning process kit compon... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,947, issued on April 7, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treating apparatus" was invented by Kenji Amahi... Read More
ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,948, issued on April 7, was assigned to LAM RESEARCH Corp. (Fremont, Calif.). "Purging spindle arms to prevent deposition and wafer sliding... Read More